Kapasitor Lapisan Tunggal Kinerja Tinggi

Kapasitor Lapisan Tunggal Kinerja Tinggi

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Deskripsi Produk

Atribut Produk

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Deskripsi Produk

Atribut Produk

Model No: Single Layer Capacitor

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Deskripsi Produk

Kapasitor Keramik Microwave RF Daya Tinggi

Kapasitor Lapisan Tunggal

General Type SG	Margin Type SM	Surface Mount Type SS	Array Type SA	Multi-Electrode Type SP

Suitable for RF, microwave, and millimeter-wave applications. Capacitance range: 0.1 ~ 10000 pF	Suitable for RF, microwave, and millimeter-wave applications. Capacitance range: 0.1 ~ 10000 pF	High-precision single-layer series capacitors	An array composed of multiple single-layer capacitors, suitable for multi-channel coupling and bypass applications.	Multi-value, binary-tunable single-layer capacitors, suitable for tuning designs or microwave integrated circuits.

Standar eksekusi:

GJB2442A-2021 "Spesifikasi Umum Kapasitor Dielektrik Keramik Satu Lapis dengan Tingkat Tingkat Kegagalan"

Spesifikasi rinci:

Q/DLC20015-2019 "Spesifikasi Detail Kapasitor Dielektrik Keramik Satu Lapis dengan Tingkat Tingkat Kegagalan"

Item inspeksi ditentukan oleh standar

Inspection Group	Parameter	Test Method	Test Requirements
A1	Capacitance	GJB2442A-2021 Method 4.5.4	100% inspection
A1	Dissipation Factor (tanδ)	GJB2442A-2021 Method 4.5.5	100% inspection
A1	Insulation Resistance	GJB2442A-2021 Method 4.5.6	100% inspection
A1	Dielectric Withstanding Voltage	GJB2442A-2021 Method 4.5.7	100% inspection
A3	Visual Inspection	GJB2442A-2021 Method 4.5.2	100% inspection
B2	Bond Strength	GJB548C-2021 Method 2011.2	Gold wire diameter 25µm, minimum pull force 5gf
B2	Shear Strength	GJB548C-2021 Method 2019.3	GJB548C-2021 Method 2019.3
B3	Voltage-Temperature Characteristic	GJB2442A-2021 Method 4.5.11	GJB2442A-2021 Requirement 3.14
C1	Immersion	GJB2442A-2021 Method 4.5.12	GJB2442A-2021 Requirement 3.15
C2	Resistance to Soldering Heat	GJB360B-2009 Method 210	GJB2442A-2021 Requirement 3.16
C3	Steady-State Humidity (Low Voltage)	GJB2442A-2021 Method 4.5.14	GJB2442A-2021 Requirement 3.17
C4	Life	GJB2442A-2021 Method 4.5.15	GJB2442A-2021 Requirement 3.18

Aplikasi Produk

Ini diterapkan di sirkuit seperti isolasi, bypass RF, penyaringan, dan pencocokan impedansi pada frekuensi radio/frekuensi gelombang mikro.
Fitur produk

Strukturnya kokoh dan kinerjanya stabil serta dapat diandalkan;

Ukurannya kecil, minimal bisa mencapai 10mil x 10mil;

Cocok untuk aplikasi gelombang mikro dan gelombang milimeter, dengan frekuensi aplikasi hingga 100GHz;

Proses perakitan mikro, cocok untuk metode pemasangan seperti ikatan perekat konduktif, pengelasan eutektik timah emas, dan ikatan kawat emas.

Nomor komponen

1. Seri Kapasitor Lapisan Tunggal

General Type SG	Margin Type SM	Surface Mount Type SS

Suitable for RF, microwave, and millimeter-wave applications. Capacitance range: 0.1 ~ 10000 pF	Suitable for RF, microwave, and millimeter-wave applications. Capacitance range: 0.1 ~ 10000 pF	High-precision single-layer series capacitors. The SS single-layer capacitor is equivalent to two single-layer capacitors connected in series.

2.Ukuran dan Model:

Digit pertama dan kedua melambangkan panjang, angka ketiga dan keempat melambangkan lebar, dan satuannya adalah mil;

Contoh 1010, ukurannya 10 mils (0,254mm) x 10 mils (0,254mm).

3. Konstanta dielektrik

Konstanta dielektrik (K) < 10, contoh: K9R6 = 9,6, R melambangkan koma; Konstanta dielektrik (K) ≥ 10, contoh: K301 = 300, angka ketiga pangkat 10.
4. Bahan elektroda

Code	Terminal Type	Sputtered Metal Layer		Electroplated Layer
		Material	Thickness (µm)	Material	Thickness (µm)
M	Suitable for Au/Sn and conductive epoxy bonding; not compatible with Sn/Pb soldering.	TiW/Au	0.01 ~ 0.05 / 0.03 ~ 0.05	Au	≥ 2
P	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	TiW/Ni/Au	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
T	Suitable for Au/Sn and conductive epoxy bonding; not compatible with Sn/Pb soldering.	TaN/TiW/Au	0.03 ~ 0.10 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
F	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	TaN/TiW/Ni/Au	0.03 ~ 0.10 / 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
H	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	TaN/TiW/Pt/Au	0.03 ~ 0.10 / 0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
D	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	TiW/Pt/Au	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
E	Suitable for Sn/Pb, Au/Sn soldering, and conductive epoxy bonding.	Ti/Pt/Au	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2
X	Suitable for conductive epoxy bonding.	TiW/Ni/Ag	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.10 ~ 0.20	-	-
L	Backside suitable for conductive epoxy bonding.	Front: Ti/Pt/Au Back: Ti/Pt	0.01 ~ 0.05 / 0.1 ~ 0.2 / 0.03 ~ 0.05	Au	≥ 2